
Ge Wafer (100) 2" dia x 0.8 mm, Fine ground , P type ( Ga doped), resistivities: 0.1-1.0 ohm-cm
Ge Wafer Specification
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Growing Method: CZ
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Orientation: (100)
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Wafer Size: 2" dia x 0.8mm
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Surface Polishing: Fine ground
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Doping: Ga Doped
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Conductor type: P-type
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Resistivity: 0.1-1.0 Ohm.cm (If you would like to measure the resistivity accurately,
please order our Portable 4 Probe Resistivity Testing Instrument.)
Typical Properties:
- Structure: Cubic, a = 5.6754 A
- Density: 5.323 g/cm3 at room temperature
- Melting Point: 937.4 oC
- Thermal Conductivity: 640
Original: $359.00
-65%$359.00
$125.65Product Information
Product Information
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Description
Ge Wafer Specification
-
Growing Method: CZ
-
Orientation: (100)
-
Wafer Size: 2" dia x 0.8mm
-
Surface Polishing: Fine ground
-
Doping: Ga Doped
-
Conductor type: P-type
-
Resistivity: 0.1-1.0 Ohm.cm (If you would like to measure the resistivity accurately,
please order our Portable 4 Probe Resistivity Testing Instrument.)
Typical Properties:
- Structure: Cubic, a = 5.6754 A
- Density: 5.323 g/cm3 at room temperature
- Melting Point: 937.4 oC
- Thermal Conductivity: 640










